Ebeam & Surface Defects – a Superlative Nano Playground
Dr. Markus Waiblinger
Carl Zeiss SMT GmbH
One core step in the manufacturing of semiconductor devices is the production of the photomask reticle. Photomask repair is an essential step in the mask manufacturing process as the extension of 193nm technology and the insertion of EUV are drivers for mask complexity and cost. The ability to repair all types of defects on all mask blank materials is crucial for the economic success of a mask shop operation. In the future mask repair is facing several challenges. The mask minimum features sizes are shrinking and require a higher resolution repair tool.
At the same time mask blanks with different new mask materials are introduced to optimize optical performance and long term durability. For EUV masks new classes of defects like multilayer and phase defects are entering the stage. In order to achieve a high yield, mask repair has to cover etch and deposition capabilities and must not damage the mask. Last but not lest the mask features get more complex and the required pattern fidelity is increasing as well.
- Dr. Markus Waiblinger studied physic at the HMI Berlin/ University of Konstanz, Germany, gaining his Ph.D. in smart materials with special focus on endohedrals
- He worked for more than a decade for the semiconductor companies Infineon, AMD, Qimonda and AMTC
- Today he works for ZEISS and is responsible for the highly automated ebeam repair platform as the product manager