Otto Graf

Managing Director

Robert Bosch Semiconductor Manufacturing Dresden

Intelligent Fab - Beyond Industry 4.0

Key technology for the internet of things: Bosch to set up new semiconductor fab in Dresden

“The new wafer fab is the biggest single investment in Bosch’s more than 130-year history, ” said Dr. Volkmar Denner, chairman of the board of management of Robert Bosch GmbH. To satisfy the demand generated by the growing number of internet of things (IoT) and connected mobility devices as wells as applications relating to smart homes and smart cities, the new location in Dresden is to manufacture electronic components including wafer level tests based on silicon technologies using 300 mm wafers for application specific integrated circuits and power semiconductors. Construction of the high-tech plant is to be completed by the end of 2019.

Start of commercialization in the new high-tech plant with a first-in-kind 5G-ready communication infrastructure is scheduled for 2022.

Leading edge equipment may have over 300 sensors. Further sources for a huge amount of data are in-line, end-of-line inspection, and metrology systems. All process, product, facility and machine state data exceed terabytes. Not to collect that broad range of data but to analyze these data in a new manner leads many benefits.

The use of Artificial Intelligence (AI) will enable to set up one of the most advanced and intelligent semiconductor fab in the world. AI will improve capacity, quality, and efficiency and support results with lowest cycle time, highest productivity, fastest learning and more stable processes.

Total investment in the location will come to roughly one billion euros. As many as 700 new jobs are to be created in Dresden. With connectivity and automation growing, semiconductor and electronic components are being used in more and more areas of smart applications. By extending the semiconductor manufacturing capacity, Bosch is giving a sound basis for the future and strengthening its competitiveness and is going a very important step toward preserving and enhancing competitiveness. Bosch intends to collaborate closely with local companies, and in this way to reinforce not only Germany’s, but also Europe’s position as an industrial location.

Key figures

  • Property of app. 100.000 m²
  • Building of approx. 10 000 m² clean room area and additional areas required for operation (support, facility and utility areas), office areas, in total app. 72 000 m² gross floor space.
  • Spending of one billion Euro and creating of up to 700 jobs.

Entering Siemens (Villach, Austria) in 1980, Otto Graf looks back on a long and extensive career in semiconductor environment. The graduated Electrical Engineer (HTL Klagenfurt, Austria) gained in-depth, hands-on experience working with nearly every inch-size of wafer (12’ to 4) and a wide range of semiconductor technologies (Memory, AISIC, MES, Power MOs).

1991, Otto Graf led a project team in a joint IBM Siemens cooperation, developing 16MB memory dies. From 1992 till 2012 he held different positions in the Siemens and later Infineon Technologies semiconductor facilities in Villach and Regensburg including the complete production management for both and deputy member of the Executive Board. 2012 Otto Graf moved to TDK Epcos, acting as the COO for business groups “aluminum capacitors” and “systems, acoustics, waves” till 2016.

Since August 2017 Otto Graf is Managing Director of “Robert Bosch Semiconductor Manufacturing Dresden GmbH” and Project lead building up the new 300 mm wafer FAB of Bosch in Saxony.